TSMC and ASML recently announced that the Taiwanese fab will adopt High-NA EUV for high volume manufacture in 2030. In order to make this economical, the two giants will push the industry to adopt larger, 6-inch by 12-inch rectangular photomasks. The plan is to have a pilot line by 2031 and full high volume production in 2033. Assuming AI doesn’t kill us all by then. Big masks are a Big Change. In today’s video, I want to talk about TSMC’s big new commitment.

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