Shaping the future of semiconductors with the digital twin

Bringing a new chip design to market is not simply a matter of designing the chip then sending it to be fabricated. Building fabs is, itself, a costly and highly complex process and, even once that is completed, it will still take further time to dial in the chip fabrication process to achieve good yields. All these factors contribute to the costs, risks and challenges associated with bringing new, cutting-edge chip designs to market. So, across the chip design process, adopting the latest in digital technology isn’t just a benefit – it’s a imperative.In this episode, host Conor Peick is joined by Katherina Westrich, Global VP of Electronics and Semiconductors at Siemens, to explore how the needs of the semiconductor industry can be served by the increasing adoption of digital twin and artificial intelligence technologies and how that will shape the industry going forward.In the episode you’ll learn about: (0:44) How the semiconductor industry must adapt in the future(2:42) The importance of the digital twin in chip design(5:16) AI accelerates the semiconductor industry(6:23) Reducing ramp up time(11:05) Building new fabs vs. new chips(12:25) How to reach yield quicker  About the voices:Katharina Westrich is Global VP of Electronics and Semiconductors at Siemens. In this role Katharina heads a team focused on unlocking the potential of resilient, smart, and sustainable semiconductor and electronics manufacturing across the entire value chain.Conor Peick is a Marketing Professional creating forward-looking content for the Thought Leadership team at Siemens Digital Industries Software. Conor collaborates with industry experts and executives to produce impactful content exploring the challenges companies face and the technologies that can provide solutions.