Chiplets aren't just a trend anymore, they're becoming the default architecture for the AI era. But as the industry stacks more dies into a single package to keep up with AI and HPC demands, it's inheriting a reliability problem nobody has fully solved: when four, eight, or more dies from different processes (and sometimes different vendors) share one package, a single weak link can disqualify the entire stack — and the cost of that failure is enormous.
In this episode, OCP's Rob Coyle sits down with Evelyn Landman, co-founder and CTO of proteanTecs, to unpack why "known-good-die" testing is no longer enough and what it actually takes to reach "known-good-stack" confidence. They get into the hidden risks of multi-die packaging — thermal coupling, voltage droop, mechanical stress from through-silicon vias, and interface faults that traditional pass/fail testing simply can't catch — and how embedded telemetry is giving engineers real visibility inside the package, from bring-up and debug all the way through in-field operation.
In this conversation:
Why AI, HBM, and co-packaged optics are forcing the move to multi-die packages
How "shift-left" testing catches faults before you commit to an expensive package
Mix-and-match and binning: building a more consistent, higher-performing stack
What embedded telemetry reveals that lab-condition pass/fail testing misses
Real-time actuation and fleet-level predictive maintenance in the field
How power and thermal insight extends useful life across data centers, automotive, and physical AI
The role of OCP's Open Chiplet Economy in moving from siloed integration to open, interoperable chiplet operations
Interested in the chiplet ecosystem? Reach out to Evelyn and the proteanTecs team, and get involved with the Open Chiplet Economy work stream at the Open Compute Project.
Chapters
00:00 Intro: chiplets as the default AI-era architecture
01:11 What's pushing the industry to modular dies
03:22 The hidden cost: the problem shifts to the package
04:56 Shift-left: catching faults before you package
05:28 Single-die pass/fail vs. multi-die reality
07:25 Where reliability breaks down in the field today
10:06 What "known-good-stack" confidence looks like
12:20 Mix-and-match and binning before assembly
15:37 Embedded telemetry vs. traditional pass/fail
17:30 Thermals, hotspots, and heat-sensitive optics & memory
19:54 Real-time actuation to prevent imminent failure
20:59 Board- and fleet-level predictive maintenance
24:43 Scaling to millions of devices, tighter margins
27:16 OCP's Open Chiplet Economy & the road ahead
About the Open Compute Project
The Open Compute Project (OCP) is a collaborative community committed to redesigning hardware technology to efficiently support the growing demands on compute infrastructure. Its members span hyperscalers, ODMs, component manufacturers, and ecosystem partners — sharing open designs and working together on shared technical challenges that no single company can solve alone.
