WFE to the Moon (Still), Semicon West and OCP Insights

In this action-packed episode of The Circuit, Ben Bajarin and Jay Goldberg recap a hectic week in Silicon Valley, spanning Semicon West in San Francisco, the Open Compute Project (OCP) Summit in San Jose, and major analyst events. The hosts examine the evolving semicap and wafer equipment landscape—including insights from ASML, TSMC, and Applied Materials' new EPIC Center launch—noting how toolmakers are re-engineering cleanroom capabilities and pushing reticle limits to support massive AI accelerators and advanced packaging. They then transition to the OCP Summit floor, unpacking the physical and engineering realities of modern data center infrastructure. The discussion covers the immense crowds surrounding liquid cooling innovations (such as Delta Electronics' 3MW manifold system), the shift toward 800V DC power architectures, and the complex choices data center operators face when balancing co-packaged optics (CPO) against the surprising longevity of copper interconnects. Finally, Ben and Jay analyze the architectural trade-offs of scaling compute domains across multi-rack topologies versus squeezing maximum GPU density into single racks.