EMI shielding performance of metalized thermoplastics

Discover how thin conductive layers outperform thermoplastic compounds in EMI shielding, while durable metal-plastic adhesion enables robust integration into thermoplastic components.

EMI shielding by thermoplastics is often aimed to be accomplished through compound development. However, when electromagnetic performance is critical, that strategy quickly reaches its limits as shown by linking experimental results to simple model calculations of shielding effectiveness from the conductivity and thickness of the shielding layer. Thin, highly conductive layers such as metallized coatings, continuous carbon fiber layers, and metal grids outperform conventional thermoplastic compounds by a wide margin, especially when dealing with low frequency magnetic fields (near field shielding). The podcast furthermore addresses durable metal to plastic adhesion incl. how electroplated metal layers can be robustly integrated into thermoplastic components.

About this podcast — Made for engineers and product development teams, these easy-listening episodes explore practical engineering challenges and the material choices behind them — giving you insight you can put to work in your own designs.

At Envalior, we help you reduce time, cost, risk and CO₂. The goal is simple: to help you select and process the right material more easily, and to deliver solutions with proven impact in the real world.

More information: www.envalior.com