On this episode of Embedded Insiders, we're diving into Physical AI with Yaron Galitzky, Executive Vice President of the AI Division at Ceva Inc. We discuss the technological and market pressures accelerating the shift toward edge AI, how sensing, connectivity, and on-device inference work together to enable Physical AI applications, and the most significant implementations of Physical AI today.
Next, Rich and Vin are back with a Dev Talk discussing MCUs and analog. Not a common combination, but there are many circumstances where they should be combined, and there are advantages to having analog peripherals integrated on-chip. The two dive into how Renesas is making this process easier than before.
The IIoT Forum & AI at the Edge at electronica 2026 is being held on November 10 and 11 in Hall C6, at the Future Tech Stage, and is organized in cooperation with Embedded Computing Design.
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