Thermal management is a “hot” topic right now, and with today’s rising power densities, thermal issues are moving into more mainstream PCB designs. If you’ve ever wondered whether you could squeeze another heat sink onto your board, you won’t want to miss this episode of PCB Chat.
Chris Parker is the director of product engineering at TCLAD, a company that develops PCB materials designed for managing excessive heat. Today, Chris discusses a case study that TCLAD conducted with the Rochester Institute of Technology. Researchers built two electrically identical test boards – one constructed with standard FR-4, and one with TCLAD’s SFL-12 dielectric.
As Chris explains, the choice of dielectric made a big difference in surface temperatures, with one power component running 26 degrees cooler on the board made with TCLAD material than on the FR-4 test board. He also walks us through what they learned from the use of thermal bridges.
Podden och tillhörande omslagsbild på den här sidan tillhör
PCEA. Innehållet i podden är skapat av PCEA och inte av,
eller tillsammans med, Poddtoppen.
